Tag Archives: Intel Core i5-L 16G7

Intel Foveros 3D Stacking Technology : A Quick Primer!

The new Intel Lakefield hybrid processors use Foveros 3D stacking technology to create such compact and power-efficient processors.

Here is a quick primer on Intel Foveros, and how it lets Intel stack different components into such a tiny chip!

 

Intel Foveros : What Is It?

Intel Foveros is a 3D stacking technology that basically stacks combines two or more dies into a single package, to offer :

  • Standby power 1/10th of competing designs
  • 50% better graphics performance
  • 40% core area reduction
  • 40% Z height reduction

 

Intel Foveros : 3D Stacking Explained!

Intel Foveros more accurately refers to how they stack the two logic dies, using the Foveros connection.

The Base Die, which consists of logic for audio, USB, USF 3.x and PCI Gen 3 controllers, are manufactured on the Intel P1222 process, which is a 22nm FinFET Low Power process, optimised for low current leakage.

The Compute Die on top has the four Tremont low-power cores, and single Sunny Cove high-performance core, as well as up to 64 Gen11 graphics cores. This die is fabricated on P1274 – their 10 nm process technology.

Intel then stacks up to 8 GB of LPDDR4X memory on top of this Foveros-stacked package using standard Package-on-Package (PoP) stacking technology.

This Intel video shows how they manufacture Foveros packages, and turn them into processors.

 

Intel Foveros : First Used In Intel Lakefield

The first processors to use Foveros is the Intel Lakefield hybrid processors, which stacks two logic dies with two DRAM layers, creating a package that is only 12 cubic mm in volume!

This allows them to create a single-sided compute board that is just 30 x 123 mm in size, with standby power as low as 2.5 mW!

Recommended : Intel Core i5-L 16G7 + Core i3-L 13G4 Hybrid Processors!

 

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Intel Core i5-L 16G7 + Core i3-L 13G4 Hybrid Processors!

More than a year after Intel showcased their Lakefield hybrid processors, they finally launched the Intel Core i5-L 16G7 and Intel Core i3-L 13G4 hybrid processors!

Here is a quick primer on both of these new Intel Lakefield hybrid processors…

 

Intel Lakefield : What Is It?

Intel Lakefield is a new family of hybrid processors designed for ultra-compact mobile devices. Offered as a compact Compute SoC, it promises benefits like :

  • Standby power 1/10th of competing designs
  • 50% better graphics performance
  • 40% core area reduction
  • 40% Z height reduction

By leveraging their Foveros 3D die stacking technology, Intel Lakefield combines 4 low-power Tremont cores, with a high-performance 10nm Sunny Cove core, and up to 64 Gen 11 graphics cores, into a package that is just 12 x 12 mm in size, and 1 mm thick.

Recommended : Intel Foveros 3D Stacking Technology : A Quick Primer!

 

Intel Core i5-L 16G7 + Core i3-L 13G4 : First Lakefield Hybrid  Processors!

After protracted development, Intel finally announced their first two Lakefield hybrid processors – the Intel Core i5-L 16G7 and Intel Core i3-L 13G4.

They are also officially known as Intel Core processors with Intel Hybrid Technology. Either way, their names are quite a mouthful!

In addition to being the first Intel Core processors using the Foveros 3D stacking technology, they are the first Intel Core processors to :

  • ship with Package-on-Package (PoP) LPDDR4x memory, for reduced board size.
  • feature SoC standby power as low as 2.5 mW – 91% lower than Intel Y-series processors
  • feature native dual internal display pipes to directly support foldable / dual-screen PCs

Both the Intel Core i5-L 16G7 and Core i3-L 13G4 hybrid processors also boast these key features :

  • hardware-guided OS scheduling
    – enabling real-time communication between the CPU and OS scheduler, to run the right apps on the right cores
    – up to 24% better performance per SoC power
    – up to 12% faster single-threaded integer performance
  • AI-optimisation
    – flexible GPU engine compute allows for acceleration of AI-enhanced video stylisation, analytics and image resolution upscaling
  • Intel Gen11 Graphics
    – up to 1.7x better graphics performance, and 54% faster video conversion performance
    – support up to four external 4K displays
  • Gigabit connectivity
    – support for Intel Wi-Fi 6 and Intel LTE solutions

 

Intel Core i5-L 16G7 + Core i3-L 13G4 : Specifications

Specifications Intel Core i5-L 16G7
Intel Core i3-L 13G4
Fabrication Process 10 nm (compute die)
+ 22 nm (base die)
Cores / Threads 1 x Sunny Cove core
4 x Tremont (Atom) cores
Base Clock Speed 1.4 GHz 800 MHz
Single Core Turbo Clock 3.0 GHz 2.8 GHz
All Core Turbo Clock 1.8 GHz 1.3 GHz
CPU Cache 4 MB
Graphics Cores (EUs) 64 48
Max. Graphics Clock 500 MHz
Embedded Memory LPDDR4X-4267 (Up to 8 GB)
TDP 7 watts
CPU TjMax 100 °C
Imaging Support 4K @ 60 fps
– up to 6 cameras (4 concurrent streams)
I/O Support USB 3.1 Type C
PCI Express Gen3
Connectivity Options Intel Wi-Fi 6 AX200
Intel Wireless-AC 9260
Intel XMM7560 M.2
Package 12 x 12 x 1 mm, POP BGA

 

Intel Core i5-L 16G7 + Core i3-L 13G4 : Availability

Intel has only announced two design wins for Lakefield :

  • Lenovo ThinkPad X1 Fold with a folding OLED display – shipping later this year
  • Samsung Galaxy Book S – shipping in June 2020

 

Recommended Reading

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