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Topic

Speaker

Rapid Technology Cadence
- 45nm high-k metal gate
- USB 3.0
- Intel QuickAssist Technology
- The Tolapai chip
- McCreary and Danbury technologies

Patrick Gelsinger
Senior Vice President and General Manager,
Intel Digital Enterprise Group

32nm, Penryn & Nehalem
- SilverThorne 45nm processors
- Montevina mobile platform
- WiMAX

Paul Otellini
Intel Corporation President and CEO

Breaking the Barriers to Mobility
- Santa Rosa refresh
- Future mobile roadmap
- WiFi-N & WiMAX

David (Dadi) Perlmutter
Senior Vice President and General Manager,
Intel Mobility Group

Unleashing the Internet Experience
- The Menlow 45nm platform
- The Moorestown SOC platform

Anand Chandrasekher
Senior Vice President and General Manager,
Intel Ultra Mobility Group

 

Anand Chandrasekher Speaks On Unleashing the Internet Experience


David (Dadi) Perlmutter, Intel senior vice president and general manager, Mobility Group, and Anand Chandrasekher, Intel senior vice president and general manager of the Ultra Mobility Group, answer questions from reporters on the latest trends in mobile computing.

Intel Senior Vice President and General Manager, Ultra Mobility Group, Anand Chandrasekher discussed the growing need of mobile users to communicate, entertain, stay informed and be productive on-the-go. Chandrasekher outlined Intel’s strategy to unleash the full Internet for mobile users by using low power IA platforms, which drastically reduce CPU and chipset power performance.

Intel “Menlow” Platform Enables Full Internet in Your Pocket in 2008 – Chandrasekher discussed the upcoming Intel Menlow platform, scheduled for launch in 1H’08, which is comprised of a ground-up designed processor, codenamed Silverthorne, based on a new 45nm Hi-k low power microarchitecture and a new chipset, codenamed Poulsbo, based on a ground-up single-chip design. He highlighted that a Menlow platform will deliver great performance at low power and could fit in a 74mm x 143mm sized motherboard, thus enabling a full Internet experience while enabling form factors that are small enough to fit in your pocket. Chandrasekher showed how Silverthorne draws 10x lower power compared to today’s lower-power processors (based on pre-silicon estimates). Also, he discussed standardized communications options such as Wi-Fi, 3G and WiMAX for MIDs and UMPCs, thus enabling connected experiences.

Intel “Moorestown” Platform Headed for 10x Idle Platform Reduction – Chandrasekher provided a sneak peek into the future Intel Moorestown platform which consists of a System on Chip (SOC) and a Communications Hub. The SOC integrates the CPU, graphics, video, and memory controller to a single chip and brings the 45nm process benefits to the complex. The Communications Hub provides I/O capabilities for storage, features, and wireless integration and the architecture allows for ultra low power operation. Chandrasekher announced that the platform idle power for a Moorestown-based MID platform will be 10x lower compared to a Menlow-based platform.

Mobile Internet Device Innovation Alliance Shows Progress – Intel had announced the formation of the MID Innovation alliance at IDF Beijing in April with industry-leading systems manufacturers Asus*, BenQ*, Compal*, Elektrobit*, HTC*, Inventec* and Quanta*. Chandrasekher announced that these companies had made significant progress over the past 6 months on Intel-based Menlow platforms and are on track to bring platforms to the marketplace in the first half of 2008. He showed working prototypes from Asus, BenQ, Compal, Elektrobit, Inventec and Quanta during his speech as evidence of this progress.

Intel Announces Strategic Collaborators for MID and UMPC Categories – In a sign of growing momentum in the industry, Chandrasekher announced more than 15 industry leaders which have embraced Intel’s “Full Internet in Your Pocket” vision, are investing in the UMPC and MID categories, and are expected to bring products over time. These companies included system manufacturers such as Aigo*, Clarion*, Fujitsu*, Harman-Becker*, Hitachi*, Lenovo*, LG Electronics*, NEC*, Panasonic*, Samsung*, and Toshiba*, and service providers such as Clearwire*, KDDI*, Korea Telecom*, NTT DoCoMo* and Sprint.

 

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Date Revision Revision History

21-09-2007

1.0

Initial Release.



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