VIA Mobile360 Demonstration @ Embedded World 2016

Taipei, Taiwan, 23 February, 2016 – VIA Technologies, Inc. today announced that it will demonstrate the new VIA Mobile360 In-Vehicle Surround View Fleet Management System at Embedded World 2016. The company’s booth is located at 4A-251 in Hall 4 of the Nuremberg Exhibition Centre.

VIA Mobile360 Demonstration @ Embedded World 2016

Specifically designed for real-time commercial vehicle monitoring, security, and tracking applications, the system utilizes VIA Multi-Stitch Technology to seamlessly combine up to six camera feeds on the fly and create an all-encompassing 360° view that can be viewed locally or remotely.

 

VIA Mobile360 Key Features

  • Ruggedized chassis with extended temperature support
  • Flexible voltage input
  • Up to 8 PoE or 8 CSI camera support
  • 360° real-time display
  • Local recording and storage
  • Video encoding for remote viewing
  • VIA Multi-Stitch Technology

The VIA Mobile360 In-Vehicle Surround View Fleet Management System provides a flexible ruggedized solution that can be customized to meet the requirements for multiple in-vehicle applications and environments. With its sophisticated 3D imaging algorithms, VIA Multi-Stitch Technology not only ensures stunning spherical images but also supports dynamic multidirectional monitoring around the vehicle from an almost unlimited range of easily-configurable perspectives.

VIA Mobile360 @ Embedded World

The VIA Mobile360 In-Vehicle Surround View Fleet Management System is one of a host of innovative new Enterprise IoT and Mobile360 innovations that are on display at the VIA booth at Embedded World. Other highlights include:

  • VIA Mobile360 HMI Starter Kits: Available in a choice of Android- and Linux-based configurations, VIA Mobile360 HMI Starter Kits feature a highly-integrated low power motherboard and a choice of validated LCD screens to provide the fastest and smoothest path for building a host of all-in-one smart display devices for a wide variety of in-vehicle infotainment and digital signage applications.
  • VIA ETX-8X90-10GR Module: Harnessing the ultra low power consumption and advanced performance of the new VIA Eden X1 processor, this flexible new module provides a powerful upgrade for systems currently featuring end-of-life processor modules while maintaining full legacy software support.
  • VIA Alegro 100 Smart Home Automation System: With its support for Bluetooth, Wi-Fi, ZigBee, Z-Wave, and KNX-RF, this multi-protocol home gateway device provides a flexible solution for a host of smart home automation applications and can be customized to meet your exact requirements.

Support Tech ARP!

If you like our work, you can help support out work by visiting our sponsors, participate in the Tech ARP Forums, or even donate to our fund. Any help you can render is greatly appreciated!

Comments

comments

About The Author

Related posts

Leave a Reply

%d bloggers like this: